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1

Temperature prediction of rolling tires by computer simulation

Yeong-Jyh Lin, Sheng-Jye Hwang

Journal:

Mathematics and Computers in Simulation

Year:

2004

Language:

english

File:

PDF, 639 KB

english, 2004

2

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Warpage simulations with P-V-T-C equation and experiments of fan-out wafer level package after encapsulation process

Deng, Shang-Shiuan, Hwang, Sheng-Jye, Lee, Huei-Huang, Huang, Durn-Yuan, Shen, Geng-Shin

Year:

2010

Language:

english

File:

PDF, 169 KB

english, 2010

3

[IEEE IECON 2007 - 33rd Annual Conference of the IEEE Industrial Electronics Society - Taipei, Taiwan (2007.11.5-2007.11.8)] IECON 2007 - 33rd Annual Conference of the IEEE Industrial Electronics Society - Control of Hot Runner Type Micro Injection Molding Module

Yang, Cang-Chin, Hwang, Sheng-Jye, Lee, Huei-Huang, Huang, Deng-Yuan

Year:

2007

Language:

english

File:

PDF, 1.61 MB

english, 2007

4

Simulation of infrared rapid surface heating for injection molding

Pei-Chi Chang, Sheng-Jye Hwang

Journal:

International Journal of Heat and Mass Transfer

Year:

2006

Language:

english

File:

PDF, 872 KB

english, 2006

5

Volume Shrinkage Characterization of Underfill Materials

Shang-Shiuan Deng, Chia-Yi Ho, Huei-Huang Lee, Sheng-Jye Hwang, Durn-Yuan Hwang

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 694 KB

english, 2011

6

Static analysis of the die picking process

Yeong-Jyh Lin,, Sheng-Jye Hwang,

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2005

Language:

english

File:

PDF, 936 KB

english, 2005

7

Design and fabrication of an IC encapsulation mold adhesion force tester

Shyang-jye Chang, Sheng-jye Hwang

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2003

Language:

english

File:

PDF, 455 KB

english, 2003

8

Warpage Prediction and Experiments of Fan-Out Waferlevel Package During Encapsulation Process

Shang-Shiuan Deng,, Sheng-Jye Hwang,, Huei-Huang Lee,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 1.06 MB

english, 2013

9

Design and fabrication of an IC encapsulation mold adhesion force tester [Abstracts of Forthcoming Manuscripts]

Shyang-Jye Chang,, Sheng-Jye Hwang,

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2003

Language:

english

File:

PDF, 145 KB

english, 2003

10

Modeling a working coil coupled with magnetic flux concentrators for barrel induction heating in an injection molding machine

Bui, Huy-Tien, Hwang, Sheng-Jye

Journal:

International Journal of Heat and Mass Transfer

Year:

2015

Language:

english

File:

PDF, 3.56 MB

english, 2015

11

Development of barrel heating system in injection molding machine via induction heating

Bui, Huy-Tien, Hwang, Sheng-Jye

Journal:

Rapid Prototyping Journal

Year:

2015

Language:

english

File:

PDF, 284 KB

english, 2015

12

Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill

Wu, Kuo-Tsai, Hwang, Sheng-Jye, Lee, Huei-Huang

Journal:

Journal of Electronic Materials

Year:

2017

Language:

english

File:

PDF, 4.58 MB

english, 2017

13

Study of P-V-T-C Relation of EMC

Chang, Yi-San, Hwang, Sheng-Jye, Lee, Huei-Huang, Huang, Durn-Yuan

Journal:

Journal of Electronic Packaging

Year:

2002

Language:

english

File:

PDF, 155 KB

english, 2002

14

An Efficient Solution for Wire Sweep Analysis in IC Packaging

Su, Jerry, Hwang, Sheng-Jye, Su, Francis, Chen, Shou-Kang

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 418 KB

english, 2003

15

Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance

Lee, Hung-Lung, Chang, Shyang-Jye, Hwang, Sheng-Jye, Su, Francis, Chen, S. K.

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 823 KB

english, 2003

16

Process optimization for directed energy deposition of SS316L components

Lin, Pei-Yi, Shen, Fang-Cheng, Wu, Kuo-Tsai, Hwang, Sheng-Jye, Lee, Huei-Huang

Journal:

The International Journal of Advanced Manufacturing Technology

Year:

2020

File:

PDF, 3.23 MB

2020

17

Predicting the process induced warpage of electronic packages using the P–V–T–C equation and the Taguchi method

Shiang-Yu Teng, Sheng-Jye Hwang

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.28 MB

english, 2007

18

Modeling of Viscoelastic Behavior of an Epoxy Molding Compound During and After Curing

Yeong-Jyh Lin, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 433 KB

english, 2011

19

On a porous medium combustor for hydrogen flame stabilization and operation

Su, Siou-Sheng, Hwang, Sheng-Jye, Lai, Wei-Hsiang

Journal:

International Journal of Hydrogen Energy

Year:

2014

Language:

english

File:

PDF, 2.23 MB

english, 2014

20

Prediction of paddle shift via 3-D TSOP modeling

Durn-Yuan Huang,, Huei-Huang Lee,, Sheng-Jye Hwang,, Su, F.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2000

Language:

english

File:

PDF, 379 KB

english, 2000

21

P-V-T-C equation for epoxy molding compound

Sheng-Jye Hwang,, Yi-San Chang,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2006

Language:

english

File:

PDF, 309 KB

english, 2006

22

Temperature prediction for system in package assembly during the reflow soldering process

Deng, Shang-Shiuan, Hwang, Sheng-Jye, Lee, Huei-Huang

Journal:

International Journal of Heat and Mass Transfer

Year:

2016

Language:

english

File:

PDF, 4.67 MB

english, 2016

23

Simulations of Process-Induced Warpage During IC Encapsulation Process

Teng, Shiang-Yu, Hwang, Sheng-Jye

Journal:

Journal of Electronic Packaging

Year:

2007

Language:

english

File:

PDF, 1.24 MB

english, 2007

24

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Simulation of Warpage Considering Both Thermal and Cure Induced Shrinkage During Molding in IC Packaging

Teng, Shiang-Yu, Hwang, Sheng-Jye

Year:

2005

Language:

english

File:

PDF, 682 KB

english, 2005

25

Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect

Pei, Chien-Chang, Hwang, Sheng-Jye

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 578 KB

english, 2005

26

AIP Conference Proceedings [Author(s) MATERIALS CHARACTERIZATION USING X-RAYS AND RELATED TECHNIQUES - Kelantan, Malaysia (18–19 August 2018)] - Observation of fiber orientation in injection molded long-fiber reinforced composites

Aditya, Rahul, Hwang, Sheng-Jye, Lee, Huei-Huang

Year:

2019

Language:

english

File:

PDF, 1.40 MB

english, 2019

27

[IEEE 2019 IEEE Eurasia Conference on IOT, Communication and Engineering (ECICE) - Yunlin, Taiwan (2019.10.3-2019.10.6)] 2019 IEEE Eurasia Conference on IOT, Communication and Engineering (ECICE) - Injection Molding Process Control of Servo-Hydraulic System

Lin, Chun-Ying, Shen, Fang-Cheng, Wu, Kuo-Tsai, Hwang, Sheng-Jye, Lee, Huei-Huang

Year:

2019

Language:

english

File:

PDF, 239 KB

english, 2019

28

Injection Molding Process Control of ServoâHydraulic System

Lin, Chun-Ying, Shen, Fang-Cheng, Wu, Kuo-Tsai, Lee, Huei-Huang, Hwang, Sheng-Jye

Journal:

Applied Sciences

Year:

2019

File:

PDF, 2.38 MB

2019

29

Flow-induced Orientations of Fibers and Their Influences on Warpage and Mechanical Property in Injection Fiber Reinforced Plastic (FRP) Parts

Huang, Chao-Tsai, Chu, Jia-Hao, Fu, Wei-Wen, Hsu, Chia, Hwang, Sheng-Jye

Journal:

International Journal of Precision Engineering and Manufacturing-Green Technology

Year:

2020

File:

PDF, 3.70 MB

2020

30

Effects of defrosting period on mold adhesion force of epoxy molding compound

Hwe-Zhong Chen, Wen-Hung Lee, Huei-Huang Lee, Durn-Yuan Huang, Shyang-Jye Chang, Sheng-Jye Hwang

Journal:

Asia-Pacific Journal of Chemical Engineering

Year:

2009

Language:

english

File:

PDF, 397 KB

english, 2009

31

Experimental investigation of infrared rapid surface heating for injection molding

Pei-Chi Chang, Sheng-Jye Hwang

Journal:

Journal of Applied Polymer Science

Year:

2006

Language:

english

File:

PDF, 395 KB

english, 2006

32

Development of an external-type microinjection molding module for thermoplastic polymer

Pei-Chi Chang, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang

Journal:

Journal of Materials Processing Technology

Year:

2007

Language:

english

File:

PDF, 1.46 MB

english, 2007

33

Simulations and experiments of three-dimensional paddle shift for IC packaging

Shiang-Yu Teng, Sheng-Jye Hwang

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 4.03 MB

english, 2008

34

Isobaric cure shrinkage behaviors of epoxy molding compound in isothermal state

Sheng-Jye Hwang, Yi-San Chang

Journal:

Journal of Polymer Science Part B: Polymer Physics

Year:

2005

Language:

english

File:

PDF, 377 KB

english, 2005

35

Injection Molding of Microprobe Array Parts

Pei-Chi Chang, Sheng-Jye Hwang

Journal:

Journal of Polymer Research

Year:

2006

Language:

english

File:

PDF, 661 KB

english, 2006

36

Investigation of adhesion phenomena in thermoplastic polyurethane injection molding process

Jian-Yu Chen, Sheng-Jye Hwang

Journal:

Polymer Engineering & Science

Year:

2012

Language:

english

File:

PDF, 1.47 MB

english, 2012

37

[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Post-mold cure process simulation of IC packaging

Chi-Hong Shue,, Sheng-Jye Hwang,, Huei-Huang Lee,, Durn-Yuan Huang,, Yao-Jung Lee,

Year:

2008

Language:

english

File:

PDF, 4.96 MB

english, 2008

38

Design and fabrication of an adhesion force tester for the injection moulding process

Jian-Yu Chen, Sheng-Jye Hwang

Journal:

Polymer Testing

Year:

2013

Language:

english

File:

PDF, 1.44 MB

english, 2013

39

Effects of Compression Distribution on PEMFC Stacks Using Reformate as Fuel

Huang, Kuan-Jen, Chen, Chen-Yu, Hwang, Sheng-Jye, Lai, Wei-Hsiang

Journal:

Energy Procedia

Year:

2012

Language:

english

File:

PDF, 1.16 MB

english, 2012

40

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Structure deformation of leadframe in plastic encapsulation

Shen, G. S., Lee, Y. J., Yeong-Jyh Lin,, Jian-Yu Chen,, Sheng-Jye Hwang,

Year:

2007

Language:

english

File:

PDF, 1.35 MB

english, 2007

41

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Correlation between Shadow Moiré and Micro Moiré techniques through characterization of flip-chip BGA

Liu, An-Hong, Wang, David W., Huang, Hsiang-Ming, Sun, Ming, Lin, Muh-Ren, Zhong, Chonghua, Hwang, Sheng-Jye, Lu, Hsuan-Heng, Bui, Huy-Tien, Deng, Shang-Shiuan

Year:

2011

Language:

english

File:

PDF, 802 KB

english, 2011

42

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - On mold corner effects of EMC adhesion for IC encapsulation process

Yeh, Chia-Hsun, Deng, Chen-hung, Lee, Huei-Huang, Hwang, Sheng-Jye, Huang, Durn-Yuan

Year:

2011

Language:

english

File:

PDF, 789 KB

english, 2011

43

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Characterization of fine-pitch solder bump joint and package warpage for low K high-pin-count flip-chip BGA through Shadow Moiré and Micro Moiré techniques

Liu, An-Hong, Wang, David W., Huang, Hsiang-Ming, Sun, Ming, Lin, Muh-Ren, Zhong, Chonghua, Hwang, Sheng-Jye, Lu, Hsuan-Heng

Year:

2011

Language:

english

File:

PDF, 5.61 MB

english, 2011

44

[IEEE 2002 8th International Advanced Packaging Materials Symposium - Stone Mountain, GA, USA (3-6 March 2002)] 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) - Wire density effect on wire sweep analysis for IC packaging

Chien-Chang Pei,, Su, F., Sheng-Jye Hwang,, Durn-Yuan Huang,, Huei-Huang Lee,

Year:

2002

Language:

english

File:

PDF, 292 KB

english, 2002

45

[IEEE 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. - Portland, OR, USA (12-15 Sept. 2004)] 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. - Simulation of warpage considering both thermal and cure induced shrinkage during molding in IC packaging

Li-Ching Hong,, Sheng-Jye Hwang,, Huei-Huang Lee,, Durn-Yuan Huang,

Year:

2004

Language:

english

File:

PDF, 428 KB

english, 2004

46

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Simulation and experiments of fan-out wafer level package during encapsulation

Shang-Shiuan Deng,, Sheng-Jye Hwang,, Huei-Huang Lee,, Durn-Yuan Huang,, Yu-Ren Chen,, Geng-Shin Shen,

Year:

2009

Language:

english

File:

PDF, 1.43 MB

english, 2009

47

[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Prediction of Process Induced Warpage of Electronic Package by P-V-T-C Equation and Taguchi Method

Chen, Jian-Yu, Teng, Shiang-Yu, Hwang, Sheng-Jye, Lee, Huei-Huang, Huang, Durn-Yuan

Year:

2006

Language:

english

File:

PDF, 1.51 MB

english, 2006

48

The influence of humidification and temperature differences between inlet gases on water transport through the membrane of a proton exchange membrane fuel cell

Huang, Kuan-Jen, Hwang, Sheng-Jye, Lai, Wei-Hsiang

Journal:

Journal of Power Sources

Year:

2015

Language:

english

File:

PDF, 2.13 MB

english, 2015

49

Synthesis and hydrogen absorption/desorption properties of Mg–Nb2O5-SWCNT/MWCNT nanocomposite prepared by reactive milling

Chuang, Yu-Siang, Hwang, Sheng-Jye

Journal:

Journal of Alloys and Compounds

Year:

2016

Language:

english

File:

PDF, 1.33 MB

english, 2016

50

Enhanced hydrogen storage properties of MgH2 co-catalyzed with zirconium oxide and single-walled carbon nanotubes

Hwang, Sheng-Jye, Chuang, Yu-Siang

Journal:

Journal of Alloys and Compounds

Year:

2016

Language:

english

File:

PDF, 1.06 MB

english, 2016